I'm a believer.
of course it has to be done and photographed for proof...but the way I see it, a mobile chip would not suffer from mal-contact between the die and wb base. Not only that though, I believe that since the IHS on regular chip a64 chips, is highly exsagerated for protective purposes and not cooling ability - having 1mm along the side of the IHS not in contact with the wb base would hardly be detrimental.
correct me if I'm wrong. I'm just going by application of the p4 heatspreader..i believe that the heat is centralized, and hardly even gets to the outer edges of the IHS.
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