/Edit: Damned tabbed browsing! By the time I read all the open tabs, someone beats me to the response.
/Edit 2: With a cursory read of the patent application, things make more sense. The peltier junctions would be micro- or nano-scale and integrated into the wafer. Looks like they intend to use them only to help cool the hottest regions, so the extra power/heat wouldn't be too large. They would have to powered by Vcore (or another voltage fed into the CPU), hence the mobo issues. It's a shame the images don't want to work for me.