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Originally Posted by Les
Assuming a simplified picture of uniform TIM layer and no contact resistance(TIM/Cu).
The usual picture is of TIM filling voids and then including Cu/Cu and TIM/Cu contact resistance
Have no authoritative links to hand (long time since looked at - put on hold - a can of worms)
Yes interferometry and load cell data would be useful but wouldn't expect a simple interpretation.
God, am struggling with the sheer volume produced so far in the Excels.
Converting to beermat format is a challenge.
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I agree about it being a can of worms, I was being tongue in cheek with regards to TIM thickness.
Load cells. Hmm you've given me an idea for measuring contact pressure. Does anyone have any links/sources for load cells, pressure sensors?
The data volume does get pretty heavy alright. For even more data I can actually sample at 1ms, as I have just tested, although I am concerned about the loading of the channels at this high rate. CPU load goes to 100%, logfiles assume massive proportions very quickly and we get saturated. But, it lets me perform some meaningful Fourier analysis in the search for mains hum and other periodic interference.