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Unread 10-27-2004, 04:17 AM   #13
Kobuchi
Cooling Savant
 
Join Date: Jan 2003
Location: BC, Canada
Posts: 313
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AMD joins late; their patent just fills gaps left by others. Peruse the 11 references sited (previous, related patents) in thepatent granted. Half already embody a peltier embedded in the package, in one way or another.

Compare, for example, BAE Systems' earlier #6,559,538,
"Contained within the package, the substrate has a front side and a back side. Electric circuits are fabricated on the front side of the substrate, and multiple thermoelectric cooling devices are fabricated on the back side of the same substrate."

with AMD's #6,800,933,
"an insulating substrate, a semiconductor structure positioned on the insulating substrate and a Peltier effect heat transfer device coupled to the insulating substrate"

One is real synthesis, the other's just clapping established parts together. That's just one example. IBM got theirs granted in 2002, Intel's (most recent) in 2001, Sun's in 1997. I'm surprised AMD got this through. Good lawyers. Further reading of the patent reveals it a thorough dredging of everything others omitted.
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