[Groth]

"Half already embody a peltier embedded in the package" (emphasis added)

There is the difference. AMD patent isn't about standard pelts in the packaging or formed on the back side of the wafer, they are planning to embed very tiny pelts into the oxide layer of SOI chips.

SOI is great for reducing transistor leakage, but the insulating oxide layer is a crappy heat conductor. Tiny pelts will bridge that thermal barrier is a hell of an idea.

Think about it: instead of using a ton of energy to cool the entire die, they can use a small about of energy to cool specifc regions. Instead of setting a clock rate and voltage that suits the hottest, slowest parts of a CPU, they can cool those specific regions and up the clock or lower Vcore.