You misquoted me, Groth, omitting my word "embed" only to place it where it doesn't belong. This is a key word here.
Quote:
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Originally Posted by Groth
they are planning to embed very tiny pelts into the oxide layer of SOI chips.
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They may be planning to embed. My point was: that's been thoroughly patented already. Check the related patents
here if you don't believe me. Neither are multiple peltiers invented in this patent. Here's an earlier one:
"Fabrication of arrays of temperature control cells of various shapes and sizes permits extremely precise heating and cooling of specific regions of the integrated circuit." - National Semiconductor
The AMD patent passed only because it is distinct from others by using the terms "positioned on" or "coupled to" rather than the already dogpiled "embedded". We can all agree "embedded" is ideal, but the fact is AMD missed it and is picking crumbs.
This patent also took an unusually long time to grant. This suggests much renegotiation of the original application,
or something.
I have nothing against AMD. The article just gives a false impression of AMD leading the way here. They're not. They're behind by quite a few months.