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Originally Posted by Starman97
The caps must be for the CPU core voltage, the tolerances are getting smaller
as the geometry shrinks. Current PowerPC chips are +/- 30mV in some cases.
That's really hard to hold when you have something like a FX55 chip that
burns nearly 100W at 1.2V core. it doesnt take much onboard or pin resistance
to drop 30mV at more than 50Amps IDD.
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Its actually 1.5 v as its a 130nm chip still. Still I think the power figures are overpessimestic. If you believe the spec, adding 200MHz made the FX use 10 amps (!) more, while the previous 400MHz worth of jumps increased current by 0 amps. More likely they simplely decided to spec Imax higher on new chips.
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I predict that you will soon see switching power supplies mounted on the CPU
package to reduce the effects of contact resistance and lead inductance.
Either that or some 7/16" studs for Vcore and GND with some 00 gauge leads.
CPU packaging is going to have to change radically to handle 200W CPU die
with a 0.9V core which is what is predicted for 65nM geometry, 200Amps...
wow.. and the real killer is the current can change within nanoseconds
from 20% to 120% of max reated currrent. the 200W is an average.
instantaneous power can be much higher, maybe 2x. for a few clock cycles.
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Not going to happen, at least in the PC market. Intels all but given up on Prescott in favor of Dothan based chips and AMD's new K8s are putting out a lot less power. Even dual core Opterons are supposed to be well under 100w, and the dual core presott keeps getting delayed (last I heard they were saying '06). Likewise IBM has scaled back power use on their desktop chips this generation, and seems to have little interest in ramping them up much higher.