[beav]

Thanks for correcting me, as my information was slightly off, and i should ahve explained some more, and i learned something new after researching this.

What i meant was the the die/slug/core/silicon is extremely flat, thus the protective coating just thinly covers this, not really affecting it's flatness. This does not excuse my extreme carelesness of words and thought.

While researching i discovered several things. It's not a protective resin as you said, or a silicon substrate as i thought before, and it's a lot more than a few microns thick. It's a copper or sometimes alluminum alloy filmed over the cache/core that measure in at .051mm. This is still pretty small, but then again i said it was microns thin. This process is called OLGA or Organic Land Grid Array and was introduced by intel with the Pentium 3.

So, both of our information was wrong. I'm sorry to have upset you so, as I was just pulling rough details from my memory, and what i have picked up from other people.

Thanks for your understanding. I still hold strong behind my opnion that lapping a FC-PGA OLGA package is not worth the risk. But that's my personal thought.