so are all of you saying that it will be best? i'm a little confused. also, i forgot to mention this. when i told him about my idea to make the waterblock base thinner to reduce the resistance, he was erm quick to correct me. he he. he said that doing that would make little to no difference in temps because the internal resistance of the copper is miniscule compared to the two other contact resistances:
a) the interface between the block and the die. for this he suggested that, if it were possible, soldering the two together might be good. he doesn't know a whole lot about the chips themselves, so i'm not sure if it work. i guess you would have to have some pretty low melting point solder. really, i bet it trasfers heat better in its liquid state. so if there would be a way to keep it liquid when the proc is running, i bet that would make a hell of a thermal joint. on the other hand, would simple arctic silver paste be better in the first place?
b)the resistance of the described stagnate layer of water in the tubes. the solution to this is merely higher flow. bascially, the best would be extremely small crossectional area and many many holes, providing that the same flow could be kept up through the block regardless of the number of holes and their diameter. i have a question though, if you were to drill enough small diameter holes to have the same crossesctional area as the inlet, would the resistance be essentially the same as just putting it through a tube? if this is the case, would it not be a good idea to just get a large block of copper and drill enough holes to equal, or even possibly exceed, the area of the 1/2" inlet and outlet. i think that would make one hell of a block. but would added weight be a problem? also, it would be best if the block were continuous, not layered. anyway. tell me what you think about this.
jungle
edit: pH, i was really thinking that someone could just drill through it with their own drill press, so no cost, or did you mean for mass marketing?
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