since the die is so small wouldn't it amke more sense to distribute the heat?
Given the same heat transfer area and wattage copper would conduct heat better. So to make up for water's lower thermal conductiviity by using copper to spread the heat right?
You'd need a very high flow rate to compentsate or the smaller area wouldn't you?
Maybe the thermal paste needed inbetween the block and the processor makes this less apparent?
Now adding an IHS would be interesting.
I'm looking at Fourier’s Law:
q = k A dT / s
where
q = heat transferred per unit time (W)
A = heat transfer area (m²)
k = thermal conductivity of the material (W/m.K or W/m.°C)
dT = Temperature difference across the material (K or °C)
s = material thickness (m)
I could be wrong i don't know much about heat transfer.
|