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Originally Posted by AveMORphine
What strikes me as odd is that most ppl start talking about the thermal conductivity when it comes to this question.
The 1 thing most seem to forget is that the water carries the energy (water can hold a bit more energy (heat) than copper can) and since the water is the carrier, everything btw the water and the heat source becomes a thermal resistance.
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Yes, but without the high thermal conductivity (or high surface area) of a copper waterblock...the temperature differential must be higher between the two (die and water) before all the heat is transfered.
You cannot look at one, without the other.
In direct die, the low thermal conductivity of water becomes the barrier - the delta between the die and the water must be higher in order to transfer all the heat produced.
With a water block, the thermal resistance of the copper and TIM become the issue - Because the high surface area makes up for the low thermal conductivity of the water/copper interface.
Remember the units - that one problem in this thread. I see tons of numbers being thrown around, most of em don't have units....and are thus worthless.
Look at JD's numbers for example. .6 and 390 - what good are they? Without the units, thermal conducitivity number mean nothing. Because thermal conductivity changes based on temp delta and surface area of contact...