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Originally Posted by Jimbo Mahoney
Bill - I guess 1'c for me is significant (anything less is immeasurable for me anyway).
I know the paper is unrelated almost, but it is true that copper oxide has a reduced thermal conductivity.
It's good to know it seems largely irrelevant.
Thanks.
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Not really an issue. It will only affect the surface, a very thin layer. It wont affect the inside structure of the copper unless it is exposed...
Between the cpu and block, the tim should stop oxide, so pollish the block first and you wont get problems from that..
The internal surface should have enough surface area to make any normal amount of oxide unnoticable even with the best test equipment...
Oxide is only an issue for heated blocks, IE Those which are soldered or braised..
However, what about annealed copper? I expect it could make quite a difference for machined o-ring sealed blocks..
Does machining a block in a miill acctually affect the hardness much?