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Originally Posted by Fimbrius
These drastic temperature changes will stress the die and package considerabley. Although not "shocking" the material properties of the package are not very forgiving to below zero temperatures coupled with rapid rises in core temperatures. This will create a significant stress gradient that will significantly reduce the life of the package.
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What drastic temperature changes? Its going to take a little while for a 2 stage system to pull down far enough that you could even turn on the system without burning out the chip. The chip itself is undergoing much sharper temperature gradients under normal use.
Hit google. This is not an issue.
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I think it would be safer to use a heater to bring the die, unpowered, to a certain temperature (say 30C) while the system powers up. This way the package and the core could be cooled simultaneously. Just my 2c. 
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That doesn't make sense. If you use a heater to keep the die at a temperature above your evaporator, you have just defeated the point of having the evaporator. And no you couldn't just have the heater on during power up because the system most likely will not POST above subambient temperatures. Remember, the point is overclocking, not to have a computer at stock speed that is uselessly cooled to subambient temperatures.