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Originally Posted by jaydee
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Now look at the "Case Temps" vs the "Die Temps" between the two.
Big difference. One slightly favors JoeC's solution, the other greatly favors the Asetek (noise-wise).
I've never liked "Case Temps", let me know what the die is doing any day of the week. Case temps can vary due to insufficient centralised clamping pressure to hold the IHS against the CPU die.
Not that the P4 die-temp sensor is a whole lot better either - sitting in a distant corner and not really located anywhere near where the heat is being generated.