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Originally Posted by jaydee
There is no point at all in using a 1" die sim. There is no CPU on the market that is comparable to it. If your going to use a die sim at least use one that is in the mid range of all die sizes. Take the largest and the smallest and build the die size in the middle. Then the results should be somewhat comparable to a similarly wattaged system. I can understand the reasoning to doing die sim tests and system based tests but not a 3rd with a completely out of whack die size. Just makes things more complicated and confusing. Maybe thats is his goal though....
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I'm with Cathar on JoeC recent change in test setups. They stayed pretty much the same for how many years?
Well having a die size too large is not good for JoeC because reading the link supplied by
bobkoure
Exploration of the Theoretical Limit of Thermosyphon Cooling System
A huge determining factor was area (cross section) of the boiling area interfacing to the heat source. Larger the area, better results. Explains why he got such a bad C/W for small die sim and a low C/W for large die sim.