I doubt it has any effect.
one thing I am looking forward to is if they use the same glue method that Intel uses on OPGA interfaces on their P3's... if they do then it will make it much harder to chip the core than the ceramic Athlons.
now when will AMD get into putting a heat spreader on... ohh that may put some of those shim scam houses out of business.
__________________
Joe - I only take this hat off for one thing...
ProCooling archive curator and dusty skeleton.
|