CPU blocks have sort of hit a wall (see Cathar's post about the G7). Making them perform better isn't really economically feasible. I belive, however, that GPU blocks can get a lot better. Think about it. The die size is about the same as a CPU (actually a lot larger most of the time, but that should make them easier to cool), and the thermal output is lower, yet we consistantly see higher temps (compare a 6800 ultra to a 4000 Sand Diego).
High performance/restriction (the two seem to go hand in hand after a certain point) GPU blocks will lead to an increased need for more powerful pumps. This is fine and dandy in the world of the ubergeek, but powerful pumps are usually too expensive for most of the market. Yet I don't see much improvement in low flow performance unless we can figure out a way to pump the heat off of the die to a larger surface area (think TEC). The guy who started liquid metal cooling is working on some sort of TEC like device to be used BETWEEN the die and the heatsink. He was a chief thermal engineer for IBM, and specialized in "micro refrigeration". Besides blabbing about it in CPU magazine last month, he's kept everything on the down low. No details, no mention of it on Liquid Metal Cooling's website. I'd be interested to see how well it works.
Time to stop rambling......
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