What heat load is the block intended for and for what die size (the °C/W isn’t a constant factor, it depends on the heat load, IE: we should revaluate the °C/W-factor and include the die area and heat load somehow in the factor)?
(My f*king computer support has shut down the license server... (its not responding anyway) so I can’t do anything until I get my hands on the idiot, I don’t have the key to the server room...)
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