Pro/Forums - View Single Post

Jackyl · 10-05-2005, 09:59 AM

Well first off, I have read this whole thread

Now after obtaining what information I could from the rather gractious use of technical terminology on a regular basis "hense the domain name". I'm going to throw a few variables in the mix and see if cathar, bigben or any of the other liquid guru's have another side to this coin?

1st) Liquid cooling is so focused towards using water. Why is this? Why not use liquid metal? It's 65x more condutive than water. Not to mention it can be used in a closed loop without a "typical pump" to move it. Just use magnets on that run off a ic board. This has been done already and the numbers are very impressive. I mean cathar, you made a round about mention to your G7 block costing 300bucks. You did this when talking about the F1 engineering. So the liquid metal costs should be nothing in comparision.

2nd) As far the the pins and jets theories go. I would just like to ask what is the thickness of the silver/copper base "both of them if you don't mind". I see that if you could make the base thinner than where the drilled pockets are in the base then this would also help with pulling the heat from the item being cooled. There would be a thinner thickness of material, and the heat would be able to transfer through it quicker. Another words, take the base of the G5 "storm" block for example. the base is copper, take it appart, mic the base thickness and then figure out how much to mill out to get it very thin, but not "weak" thin. Then possibly make the pockets depper. This would all be in hopes of getting the liquid as close to the item being cooled but yet not actually touching it, and not maching to much off to make the base tweak when it is being applied to the item being cooled.

But now if you guys have figured out a way to calculate a given thickness heat transfer principles for a given heat load. Then what I have just said is useless. If not I would like to know what you think about it because I think that it would add to the method of madness.

Also, liquid metal is the way of the future! It will replace all know liquid cooling solutions that we currently use. It will be expensive but, what I understand about it's chemical properties you will not be able to freeze it unless your using LN2 cooling to chill it :shrug:

one more thing. I thank you guys for all the work that you have done in these areas. Cathar, I do not think that your hitting a wall with your blocks, I think rather your hitting a wall with the liquids that you are trying to use to cool things with your blocks.

10-05-2005, 09:59 AM	#139
Jackyl Cooling Neophyte Join Date: Apr 2003 Location: Wisconsin Posts: 21	Well first off, I have read this whole thread Now after obtaining what information I could from the rather gractious use of technical terminology on a regular basis "hense the domain name". I'm going to throw a few variables in the mix and see if cathar, bigben or any of the other liquid guru's have another side to this coin? 1st) Liquid cooling is so focused towards using water. Why is this? Why not use liquid metal? It's 65x more condutive than water. Not to mention it can be used in a closed loop without a "typical pump" to move it. Just use magnets on that run off a ic board. This has been done already and the numbers are very impressive. I mean cathar, you made a round about mention to your G7 block costing 300bucks. You did this when talking about the F1 engineering. So the liquid metal costs should be nothing in comparision. 2nd) As far the the pins and jets theories go. I would just like to ask what is the thickness of the silver/copper base "both of them if you don't mind". I see that if you could make the base thinner than where the drilled pockets are in the base then this would also help with pulling the heat from the item being cooled. There would be a thinner thickness of material, and the heat would be able to transfer through it quicker. Another words, take the base of the G5 "storm" block for example. the base is copper, take it appart, mic the base thickness and then figure out how much to mill out to get it very thin, but not "weak" thin. Then possibly make the pockets depper. This would all be in hopes of getting the liquid as close to the item being cooled but yet not actually touching it, and not maching to much off to make the base tweak when it is being applied to the item being cooled. But now if you guys have figured out a way to calculate a given thickness heat transfer principles for a given heat load. Then what I have just said is useless. If not I would like to know what you think about it because I think that it would add to the method of madness. Also, liquid metal is the way of the future! It will replace all know liquid cooling solutions that we currently use. It will be expensive but, what I understand about it's chemical properties you will not be able to freeze it unless your using LN2 cooling to chill it :shrug: one more thing. I thank you guys for all the work that you have done in these areas. Cathar, I do not think that your hitting a wall with your blocks, I think rather your hitting a wall with the liquids that you are trying to use to cool things with your blocks.