jd
buy a manual for $17 or so, what you have is fine - you outbid me on it !
Cathar
the term is 'case to air', where 'case' is the IHS
nothing at all to do with the silicon temp
I was not attempting to make any characterization of the silicon temp
this activity is to characterize thermal resistance where the transfer is between the IHS and the heatsink, and the IHS heating is done by a device designed to do so
I believe the device may be considered to be more representative than a correction factor applied to a different device - speculation on speculation here
your concern would be better placed with the 'size correction factor', how will you determine such ?
what is the baseline ?
Ben's WTBA ?
every time I have the opportunity to follow 'industry practice' I do so, avoids time in discussion and cross-testing (and my ongoing self education)
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