Pro/Forums - View Single Post - heat die dimensions

bigben2k · 10-23-2005, 06:16 PM

Oh so much to cover (I go away for one day, and so much activity!!!). I'll tackle in varying order.

As for the die material: I have to consider what's commonly available, so I refer to our sponsor:
http://www.onlinemetals.com/index.cfm?affiliate_id=302
(link from Main page)

- Invar (an alloy of 36% nickel and 64% iron)
- Nickel Alloy R405 (similar to Monel)
- Titanium
- Tool steel (including "ALLOY 1018")
- Stainless

Maybe dubious purity, would not care to see 392, 396, 400 debated again.

My concern however is with the maintenance. Was thinking about some type of plating followed by a grind to restore die to same total height. The idea still needs thought, but all in all, copper's softness is a problem.

Damage to the heat die could be avoided/minimized with a proper mounting plate that would have "guides", but without interfering (significantly) with the final alignment. The damage expected would be a rounding of the contact area's edges.

As for dimensions, if we "stretch" (!) the Jedec 85% uniformity requirement to 85% of actual die size, then 12 by 12 mm will not do (extended, 12 by 12 is useless, see below).

I've gathered many actual core dimensions (a hard exercise!) but found most of the info at geek.com . For Intel, excluding the old Willamette core, core sizes vary between 112 mm2 and 237 mm2. That means using two dies, 10 by 10mm and 14 by 14mm, which actually does cover every core, within 15%. I have not collected all data for AMD.

Below is the collected data, complete with source links:

"CPU core dims and power"

Intel:

Smithfield 90nm
206 mm2 / 95 to 130 Watts
from THG

Prescott 2M 90nm
135 mm2 / 84 to 115W
from: http://www.digital-daily.com/cpu/intel-prescott-2m/

Gallatin 130nm
237 mm2 / 54 to 97 W
from: http://www.geek.com/procspec/intel/p7server_13_4.htm

Prescott 90nm
112 mm2
from: http://www.extremetech.com/article2/...1478683,00.asp
103W
from: http://techreport.com/reviews/2004q1...t/index.x?pg=2

Northwood 130nm
131 mm2 / 61 to 68W
from: http://www.geek.com/procspec/intel/northwood.htm

Willamette 180nm
217 mm2
from: http://www.geek.com/procspec/intel/p7consumer.htm
52 to 72W
from: http://www.cpuscorecard.com/cpuprices/ip4.htm

AMD:

Toledo/Manchester 90nm

San Diego 90nm
115 mm2 / 104 W
from: http://www.tomshardware.com/cpu/2005...n_fx57-02.html

Clawhammer 130nm

Venice 90nm

Newcastle 130nm

Winchester 90nm

Sledgehammer 130nm

Clawhammer 130nm

Clawhammer old 130nm

Newcastle 130nm

Paris 130nm

Palermo 90nm

Thoroughbred B 130nm

Thoroughbred A 130nm

Barton 130nm

Thorton 130nm

10-23-2005, 06:16 PM	#15
bigben2k Responsible for 2% of all the posts here. Join Date: May 2002 Location: Texas, U.S.A. Posts: 8,302	Oh so much to cover (I go away for one day, and so much activity!!!). I'll tackle in varying order. As for the die material: I have to consider what's commonly available, so I refer to our sponsor: http://www.onlinemetals.com/index.cfm?affiliate_id=302 (link from Main page) - Invar (an alloy of 36% nickel and 64% iron) - Nickel Alloy R405 (similar to Monel) - Titanium - Tool steel (including "ALLOY 1018") - Stainless Maybe dubious purity, would not care to see 392, 396, 400 debated again. My concern however is with the maintenance. Was thinking about some type of plating followed by a grind to restore die to same total height. The idea still needs thought, but all in all, copper's softness is a problem. Damage to the heat die could be avoided/minimized with a proper mounting plate that would have "guides", but without interfering (significantly) with the final alignment. The damage expected would be a rounding of the contact area's edges. As for dimensions, if we "stretch" (!) the Jedec 85% uniformity requirement to 85% of actual die size, then 12 by 12 mm will not do (extended, 12 by 12 is useless, see below). I've gathered many actual core dimensions (a hard exercise!) but found most of the info at geek.com . For Intel, excluding the old Willamette core, core sizes vary between 112 mm2 and 237 mm2. That means using two dies, 10 by 10mm and 14 by 14mm, which actually does cover every core, within 15%. I have not collected all data for AMD. Below is the collected data, complete with source links: "CPU core dims and power" Intel: Smithfield 90nm 206 mm2 / 95 to 130 Watts from THG Prescott 2M 90nm 135 mm2 / 84 to 115W from: http://www.digital-daily.com/cpu/intel-prescott-2m/ Gallatin 130nm 237 mm2 / 54 to 97 W from: http://www.geek.com/procspec/intel/p7server_13_4.htm Prescott 90nm 112 mm2 from: http://www.extremetech.com/article2/...1478683,00.asp 103W from: http://techreport.com/reviews/2004q1...t/index.x?pg=2 Northwood 130nm 131 mm2 / 61 to 68W from: http://www.geek.com/procspec/intel/northwood.htm Willamette 180nm 217 mm2 from: http://www.geek.com/procspec/intel/p7consumer.htm 52 to 72W from: http://www.cpuscorecard.com/cpuprices/ip4.htm AMD: Toledo/Manchester 90nm San Diego 90nm 115 mm2 / 104 W from: http://www.tomshardware.com/cpu/2005...n_fx57-02.html Clawhammer 130nm Venice 90nm Newcastle 130nm Winchester 90nm Sledgehammer 130nm Clawhammer 130nm Clawhammer old 130nm Newcastle 130nm Paris 130nm Palermo 90nm Thoroughbred B 130nm Thoroughbred A 130nm Barton 130nm Thorton 130nm __________________ WBTA (Water Block Testing Alliance) Nordic Hardware WC 101