looky here:
http://www.tc.co.uk/news/news_minisensors.htm
info on 4-wire 0.5mm dia RTDs requested
bobo
water chillers, chamber, inst., etc. all good to go in an hour
the problem was with a heat die having 4+" of insulation coming to a steady state condition (reading to hundredths eh ? with a probe in the insulation)
my preference would be for a heat die designed (or adapted) to have a 20% secondary heat path loss, this a nominal mobo/socket (through the traces) sink 'value' described at an IDF by Intel
the actual value is different for every board