Ah i see.
Im worried about this secondary heat path as you are no longer exactly sure (for a well laged die) of the power input. Surely it would be easier to just apply an analytical model and say there is 20% less heat input and such. It is far easier to insulate everything well than have a well designed secondary path with debatable characteristics.
Could also try and use emprical relationships using a watercooling loop to measure energy output into it from a cpu versus the actual cpu power. Given that the heat die system can give you everything else.
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