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maxSaleen · 11-21-2005, 11:41 AM

I have noticed over the past year that a common issue that arises on the forums is the difference between testing with a large die and a small die. The difference being that large dies are used to simulate a CPU with an IHS, and a small die being used to simulate direct WB to CPU contact.

Seeing that (almost) all contemporary CPUs use an IHS, coudn't one find an "optimum" solution by placing a (fabricated) IHS over a small die (thermocouple)? Would this not give the best indication of "real world" usage? Just a thought, and IMHO, obviously, seeing that I'm not a PRO.

11-21-2005, 11:41 AM	#1
maxSaleen Cooling Savant Join Date: Dec 2004 Location: Orlando, Florida Posts: 383	Test bench idea.... I have noticed over the past year that a common issue that arises on the forums is the difference between testing with a large die and a small die. The difference being that large dies are used to simulate a CPU with an IHS, and a small die being used to simulate direct WB to CPU contact. Seeing that (almost) all contemporary CPUs use an IHS, coudn't one find an "optimum" solution by placing a (fabricated) IHS over a small die (thermocouple)? Would this not give the best indication of "real world" usage? Just a thought, and IMHO, obviously, seeing that I'm not a PRO.