not possible
you will be unable to REPLICATE the mfgr's TIM joint
you/we know neither the matls nor the procedure nor can we replicate the (mechanical) mounting with a loose IHS/shim
anything other than a CPU will require correlation
correlation of raw temps to specific CPU case temps has only been done for the heat sources being criticized, and is not public in any case
2 somewhat extreme sizes could be used to look at source size sensitivity ?
or 1 avg ?
lol
and what about rectangular CPUs and wb orientation ??
-> do we have to test every configuration ? (what/who defines the combinations 'needed' ?)
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