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Originally Posted by nikhsub1
RE the IHS with AMD vs. Intel; Intel used to have poor IHS to core mating, back in the Northwood days. I experienced a 2.6 which after removing the IHS I lost 9C, with 3 other Northy's that I popped the lid I lost about 3C. Intel today has a MUCH better way of bonding the IHS to the core and it is virtually impossible to remove the IHS from an Intel CPU today. I fear from what I am hearing that AMD has garbage IHS to core bond, until they fix this issue it would be best to pop the lid, this I am sure of.
No, I suggest you go read the thread, this is NOT about popping IHS's. The AMD ihs to core integrity is SHIT, no two ways about it. And, you obviously have not been reading or you would KNOW that Intel IHS's are almost impossible to take off
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I can accept that the AMD bonding is not consistant enough for repeated WB testing (@5 mounts per WB).
Beyond that you have established that Northwood bonding was shit, but not that the current Intel system is superior in any way to the AMD system for normal or extreme use. AMD's TIM may be superior to epoxy. (Didn't Intels overheating heating problems begin with it's use?)
Some may consider the inability to remove Intels IHS a fatal flaw.
If AMD's joint broke down in the first few remounts you would have a point, but I haven't experienced any problems with either of mine.
edit: "It changes from CPU to CPU, and one IHS capped CPU will appear to favor one waterblock, while the exact sameCPU type from the same manufacturing batch will favor a different waterblock." Now this can indicate a problem, need American, union workers to correct!!!