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where is the DIE TEMP to be measured, and how ? (I missed this in your post)
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For those struggling to picture what I mean, imagine something like a 13x13mm (or whatever sized) copper heat die with a "mushroom" IHS lid on it, but all one solid piece. In fact the word "mushroom" pretty much exactly describes the sort of one-piece thing I'm talking about. Heat energy is applied at the mushroom stalk, the temperature of the die is taken from the center of the stalk just below where the IHS "head" starts to fan out. Heck, groove the IHS head and stick a TC in there too, ala Intel TTV style, and then we can validate that the relationship between IHS surface temp and stem temp is consistent.
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Of course as said this has no correlation to CPU die temp, or some such correlation would have to be developed (if of interest).
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do you know what the TTV has that no die will ever have ?
repeatability, lesser absolute performance but a greatly reduced range
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How is a TTV more repeatable than a heat die?