To clarify for the popcorn munchers... (I'll play the "roadside commentator", as Cathar zooms by

)
While testing, a raw core-side temperature measurement will be taken.
One of the points brought up is that the TIM joint under the AMD and Intel IHS may vary in quality, over time. The result is that it becomes more difficult to apply an offset (to the raw core-side measurement), and predict what actual temperature an AMD CPU would report. It also makes using an actual AMD / Intel processor as a testing platform a bit more complicated.
Cathar's objection, as I understand it, is not that the TTV's TIM joint under the IHS may be variable, but that it is not checked for a variation. Bill's reply; it's just a (repeatable) heat source.
Orkan; we test at fixed power levels, usually on the high end (70 to 100 W). Cooling solutions perform less at different power levels. Accuracy and repeatability are prime; we're shooting high here.
Annirak; secondary losses exist, and they are very hard to quantify. Intel has parameters for the testing environment.
Otherwise the issue of having a die simulator whose size is different than an actual processor, remains. We did however agree on 10mm by 10mm and 14mm by 14 (in another thread) as it covers most processors. We can revisit yearly, that's fine, but must start somewhere (I'm so far behind!!!).
I'm all for the proposed mushroom cap; seems fine, just because the Intel TTV is hard to get (?). Can we agree on 1.4mm as IHS thickness? Can we get together on one mushroom cap? Can we still have a TIM joint of some sort? (Raw copper stock in 36mm by 36mm is not obvious, but 36mm by 1.4mm bar stock is easy) (let the popcorn flow!)
Bill's point remains: -> how is the die face to be maintained ?
Can we do nickel plating?
I am excited about the thermocouple solution, but fear the cost of EDM'ing anything to .3mm .
5 TCs in the IHS? Wouldn't be more reliable to have 5 IHS with one TC in each quadrant, then center? Either way, it would be for additional study, no direct relation to cooler testing, right?