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to use a heat die, and then affix a salvaged IHS to that...
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Not my point - point was so Bill had an A64 to remove IHS off and assess quality of current mounting solution (bond of IHS to CPU / Wafer and TIM Joint) to base a more qualifiable replication on in terms of mounting method only.... not to actually use any of the parts for a test.
The testers here in this thread wouldn't be stupid enough (I'll assume on your collective behalves) to use a salvaged IHS.... they know it'd immediately rule out any data produced.