an IHS lasts indefinitely, its surface is huge and the edges non-critical
if you ever get a flat die, leave it alone
if a die is used it must have multiple in-line sensors to extrapolate the face temp (see Incoherent's setup for an eg, Intel and IBM have published examples)
this is a monster already, I'm gonna let someone else make a prototype
some new CPUs have significantly reduced clamping force
and why ?
once the IHS 'crown' is deflected into the same plane as the IHS edges (i.e. the TIM joint is compressed as designed), the additional load is transmitted to and through the package to the mobo
this is pointless hence the reduced clamping forces IMNHO
I do think a parting of the ways is appropriate for those using an IHS vs those not
testers can cater to one group or another or both as they see fit
this could perhaps 'justify' lower resolution testing on CPUs, and more rigorous work on a heat die
??
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