[pHaestus]

Hi guys

I have a little experience testing with CPUs. I have encountered some problems I am not certain are surmountable doing my old "solder in wires trick" with AMD64s. So I am laughing a little at the idea of Bill heading towards CPU based testing while I think on using a die sim instead.

I would chime in that I think a die temp and an IHS temp should both be taken if you're using a CPU. Otherwise you'll never know if the internal TIM joint is being degraded. That leaves only AMD systems, but they are the ones with IHS TIM problems in the first place! I assume what Bill is planning is ONLY taking the IHS temp and then relying on a correlation back to die temp provided by Intel. Sounds ok to me, but not sure it's going to properly address the whole real picture (look at Groth's picture again). I could do these sort of correlations for AMD with my current testbed, but I really feel like within a few weeks of testing the processor is going to break.