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Unread 12-08-2005, 04:41 PM   #34
Marci
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Join Date: May 2003
Location: Wakefield, West Yorkshire, UK
Posts: 486
Default Re: The plan for my next week

For reference, Intel uses Indium Solder for it's TIM1 joint (die to IHS) in current gen cpus - http://www.enerdynesolutions.com/lea...nterfaces.html << last paragraph - only public source I can find to quote... but it's fact.

http://www.intel.com/technology/itj/...linterface.htm
That's the 2005 uptodate document on their current research into the gels they intend to use to replace it... (Look into Low Melt Alloys and Indium Solder and you'll find longterm reliability issues that may or may not have been addressed... but Indium isn't up to the job longterm... especially when working at -55 deg C temps - phasechange crowd beware... see AMD link below for some projections of when phasechange Direct Die projectedly becomes necessary.)

Also recommend http://www.intel.com/technology/itj/...ol09_art03.pdf
Bookmark: http://www.intel.com/technology/itj/index.htm if u ain't already and keep an eye on it for newer info...

Some info on page 9 onwards for AMD CPUs TIM1 here, as well as hints of trouble ahead: http://www.apialliance.com/pdf/Archi...Touzelbaev.pdf

Last edited by Marci; 06-29-2007 at 04:02 AM.
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