[Les]

Originally Posted by Marci

...Some info on page 9 onwards for AMD CPUs TIM1 here, as well as hints of trouble ahead: http://www.apialliance.com/pdf/Archi...Touzelbaev.pdf

Yes, am finding some useful info in links.

Concur with AMD's "Die Thinning: Beware of Hot Spots".
For "at-the-die-surface heat flux cone diameters"< ~5mm, modelling suggests TIM(0.06c/w per cm^2) rules( (contributes>50% of Resistance) for all wbs
Would add. a bit of edge cooling could work wonders : Modelling suggests a highly potent effect of ,say, a 150w/m^2K(forced air in 0.5mm gap) side "Heat Transfer Coefficient" in reducing a spike a hundredfold ,given of course there is a dT to cool.

Edit: Anyone know undercup bp thickness of the Storm G4 ?
Have upped from 0.7625mm to 1.2625mm following Cathar's "Storm's bp is substantially thicker than 1mm" (link to page).
Is this right?