[BillA]

I suspect that AMD and Intel have not been 'the same' for some time
one always needs to bear in mind that IHS 'flatness' is as mounted, not that which is seen when the package is unconstrained
Tim1 compression is as mounted, not loose; the IHS crown, edges, CPU package, socket, mobo, etc. all take part of the applied clamping force
nor are all the same (see Nicona), and BTX to come which 'float'

the mechanical loads on a 'large' IHS during the removal of a sink can be considerable, removing pinned CPUs with the sink is almost the norm
these loads, and severe thermal cycling, will de-couple a grease TIM over time
I'm quite unsure of any value derived from testing a Tim1 joint generally agreed to degrade over time

if the goal (not of this thread, eh ?) is to develop a test platform, concentrate on possible candidates

this is 'our' problem, we cannot focus and make choices - just endless debate