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Originally Posted by Joe Camel
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"real-world" IHS VS. die temps:
could one modify an IHS by milling a slot through the sidewall, and if needed, part way into the face of the IHS so that a thermal probe could be inserted "under" the IHS and come in contact with the (side of) core?
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JC,
My French is weak, however, you're looking for something like this ...
http://membres.lycos.fr/roscool
(From Roscol's Cooling-Masters site.)
Too bad we can't laser etch the IHS with channels and make it the base of our cooling block.
But, then again, we're not IBM who holds those patents.
Stev