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Originally Posted by BillA
make Tim1 75% of Tim2 if modeling for an Intel IHS w/solder joint (it is lower, this is a guess)
are you not going to wind up with an 'effective' thickness just as for area ?
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Yes and no.
Baseplate thickness is distance from base to lowest part of structure. All copper above this is part of h(eff).
HOWEVER. Of course the temperature profile will not be even 1µm below this "slice", it will be affected by the geometry above, so in that respect the model is flawed. The h(eff) approach counts on uniformity here. Hopefully it spreads enough. Model mk II will look at this.
Damn, need a model to verify the model :/
One step at a time. For now a uniform h over flat surface, next a uniform h over a structured surface, then, hopefully, local h, structured surface.
That is tough, but I hope doable when I am further up the learning curve.
Will do with the soldered TIM. It's Indium? need a k, Cp, density