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Originally Posted by Marci
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Really interesting links Marci.
I wonder if it is feasible to use these AIM alloys instead of thermal compound, effectively soldering the waterblock to the CPU. The AIM 70 could be interesting, put a sliver of the foil between block and die and do a controlled heating, pump off or hot water in the loop for a few minutes.
Pretty neat. Wonder if it would bond to silicon properly...
I think we should move to another thread with the modelling. I'll start something when I have more to post.