I have cut holes in a number of backplates behind older CPUs and mounted fans.
According to the temp probes temps drop a lot, but many argue that you are just cooling down the probe. I did see slight improvements on OCability/stability though.
I feel that for the probe to be cooler everything in the area has to be cooler?
I do concede that the traces going to the probe may be less resistive, thus given an 'egzadurated?' lower temp readings?
One must also remember that 90% of the heat dissipated by Mosfets is dissipated through the metal part of it thats soldered to the MB.
(New Mosfet designs that dissipate to both sides may be out already?)
Having a fan that blows on the area behind the CPU and Mosfets wont hurt but does tend to build up a lot of dust on a critical area of the MB. So high mantainence.
I have been thinking about a large 'waterbag' similar to Koolance's new RAM & HD coolers, that fits behind the MB.
Time to buy a box of wine, polish it, and experiment, perhaps?
PS: What about filling the socket with AS Ceramique to conduct heat better to the back of the MB. Is it non-elec-conductive enough?
Perhaps a small piece of copper, coated with something non-elec-conductive in the rectangular space of the older sockets?