I have a friend of a friend that works for Intel in their thermal management lab. I'm hoping to get some perspective on what they think of our current discussions of TTV, DieSim, IHS, and such with respect to heatsink/waterblock testing. I've gotten a couple of responses so far but nothing meaty. Basically, the 1st response was "you're nuts!" and the second is "you know way to much about this stuff: use a TEC or a bigger fan".
There were, of course, other details but I'm waiting for permission to print anything that might be proprietary and such. I hope I didn't scare him off by pointing him to our forums.
There was someone else here in the forums that was working on getting a response from Intel as well. How about AMD? Does anyone here have contacts with the AMD thermal management lab? I'd like to get AMD's and Intel's official engineering response to the issues we are facing.