The impact is big, we can't ignore it ! When AMD will use solder (I hope) to get out their poor TIM1, all people will be about on a same basis. Then, no more BS and false pretexts about WB testing because IHS will be attached permanently ! Datasheets show facts about IHS, I compiled the 3 majors parts here :
AMD IHS were always thicker than Intel ones, not a suprise if you get the 2 models in your hands. And the more thicker the IHS is, the less difference you'll get between different WBs using differents techniques because of more flux spreading, no secret here too ! That's why all the tests we can see with processors and IHS reports the same (depends of precision measurement and care taken) and this is not a mistake, a fake or a lack of objectivity like I saw in the other thread !! Some people seems to land from the twilight zone, welcome in the real world guys...