[BillA]

consider 2 θjc scenarios:
1) AMD, Tim1 grease joint + IHS; ample evidence of variability/limited longevity (# of temp cycles or mountings)
2) Intel, Tim1 indium soldered + IHS; very sparse notation of variability/limited longevity
- note that absolute uniformity is not being described, just a relative comparison

θjc is the sum of both elements and will be different for each, and for AMD is known to increase over time
- note that clamping force will not change a soldered Tim1, though it can affect the IHS contact area

now consider θcs, lots of #s for this variation from pH, Lee, myself (on the TMT site), and hugely affected by the clamping force AND sink flatness

I 'know' both values (wrt Intel and Tim2) and the notion that θjc is a variable precluding hsf or wb design is simply wrong;
- on the BEST day, Tim2 = 2xTim1; typically far worse for 'field' applications

but the 'issue' has always been the allegations of θjc variability despite an entire thermal management industry based on the opposite

-> (non)flatness has a far greater effect than θjc, why is this ignored ?

crap, back on the soap box; all your fault Ben