Some more info on surfaces, as promised:
http://www.predev.com/smg/intro.htm
http://icrank.com/cgi-bin/pageman/pa...finish.htm&t=2
http://www.mfg.mtu.edu/cyberman/
Instruments:
http://www.flexbar.com/surface-roughness.htm
Plenty more hits in Google.
There appears (to me) to be a number of different aspects that this could expand into; I'll try to list:
-IHS flexion
-Core surface finish
-IHS surface finish (on both sides?)
-cooling device surface finish
Of course by "surface finish" I mean flatness as well as polish (aka waviness and roughness, respectively).
Does anyone know the AMD/Intel specs for those (I know that "something" exists)?
This goes round and round; preliminary data from Les/Incoherent suggests a 5 deg C variation across the die of a CPU (Storm block). If so, what does it mean, for us?
Obviously Tjunction has to be measured or extrapolated, and we agree (or disagree) that it's measured in the center of the die, with the assumption that it is representative.
That aside, we do know that the onboard (in-die) diode is not in the center, but we do know that the IHS groove (Intel style) measurement is centered (Intel dubs it "Tcase").
Clearly Tjunction, as currently "measured"
by various mobos, is not representative of the die temperature. pHaestus has a nice workaround (questionned on the censored forum, I believe for lack of understanding), but is that Tjunction measurement representative? I believe it is, simply because it is through the heat flux. I do want to ask (for my own curiosity) "Is it centered", and "Does anyone but AMD know?".
If I groove the backside (only) of an IHS, would it be accepted as a measurement of Tjunction?
Rambling style suxorz indeed.