I got two of them, or at least that is what the monkey in me says they are.
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I don't know which one is more ripe though..
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Originally Posted by pHaestus
It's a 3 dimensional problem basically and by using a much different TIM joint on the die sim (solder) than a real CPU I think you'd get pretty different results in terms of spreading. Also how does Intel do the soldering so that the system is flat when compressed via hs/fan? I don't know how one would reproduce that process?
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Good point. Not exactly the grease they are slathering on the AMDs.