[bigben2k]

Thanks for the reply.

I really haven't given this idea a lot of thought, that's why I threw it in here. Maybe if I throw a few more thoughts:

First, there's (essentially) not going to be any air, so there will not be any convection cooling.

The other type of heat transfer is radiation (i.e. the infrared stuff), but it's not a lot of energy.

So everything will heat up, and (essentially) none of the heat is going to go anywhere. That means that the temperature is going to keep on rising, in each and every component of the motherboard, through which power flows.

Let me throw in another bone:

Let's assume that 20% (as a guesstimate) of the power applied to the mobo-CPU combo comes out in secondary losses.

And another one:

In UHV (Ultra High Vacuum), everything works differently: there is no movement of air based on pressure differences. All of the components are rated for their leak properties (at this level of vacuum, everything actually leaks, even solid SS walls). To top it off, all of the elements are often baked, to degass them, otherwise they would add some kind of gass in the vacuum chamber.

What's going to degass from a mobo?

Should I be using a different type of TIM material?



I'm still months away from setting up the vacuum chamber, and I want to make sure that I do it safely (it can be dangerous). I'm ruling out a glass bell jar as unsafe, even with a protective cage, unless someone can explain to me how it could be used safely.