[Ice Czar]

if you want to know my real fear
its that the embedded chip cooling technology will change before we are really able to find an agreed on proceedure, IHS is just the first step, Im not even sure "waterblocks" as we know them are going to be that relevant for too much longer. There are so many developing technologies from Diamond Substrate Chemical Vapor Disposition to Carbon Nano advances in materials to nano heatpumps, dual phase microchannel and spray cooling that with the ever greater increases in power I think we are going to see integral thermal solutions sold with CPUs sooner rather than later. Intel's "waterblock" system was just the first. The IHS is basically a heatpipe base, its currentlty transferring to a seperate component but for how much longer? I think there will be a trend for the IHS to "grow" into a larger interface, that attaches to something else, possibly several options of something else.

remember alot of what drives thermal issues chip development comes from incresing densities in 1U and now blade servers
but once tooled into the fab gets transfered to the desktop

thats why Im really more interested in being able to determine the power consumption and develop a system that measures the total amount of heat whatever tech that is applied is moving to the case (or outside the case)
my "waterblock" test suite is really looking more to that direction. And I see vacumm insulation as an important part of quantifiying and isolating variables.