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Colt357tw · 06-03-2006, 10:45 PM

the reason this is not a popular method is due to the MASSIVE bonding material you have to place on individual copper layers, thus crappy thermal resistance from CPU to liquid.

Unless one would plate every single layer of copper then brazed them into a block....i cant think a way to secure copper layers for any work without distort their shape. (we are talking about less than 1mm thick of high purity copper here...)

06-03-2006, 10:45 PM	#7
Colt357tw Cooling Neophyte Join Date: Jun 2004 Location: Taiwan Posts: 55	Re: microstructures the reason this is not a popular method is due to the MASSIVE bonding material you have to place on individual copper layers, thus crappy thermal resistance from CPU to liquid. Unless one would plate every single layer of copper then brazed them into a block....i cant think a way to secure copper layers for any work without distort their shape. (we are talking about less than 1mm thick of high purity copper here...)