Time to put the theory into practice and see if this is a viable option. There has been some discussion on the subject over the years and some may have done it but if they have i cannot find it. Therefor I have constructed this to see if all my theories about this approach are reasonable.
Theoretical cons:
1) IHS has no center pressure to make the IHS contact the die well.
2) Laminar flow and low surface area making heat removal less efficient.
Theoretical positives:
1) Removes TIM layer.
Known positives:
Very cheap to make.
I already ran a few other blocks (MP-05-SP, Stock Retail Sempron Cooler and a DD Maze4) through the test bench on this Sempron CPU at stock speeds and overclocked. So if the thing doesn't fry right off the bat then I will have some comparative results.
