/offtopic
Quote:
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Originally Posted by derelict
Oh I also got some new parts, bought it off craigslist   
DFI P965-S Dark + C2D E6550 + 4gb DDR800 4-4-4-15 (OCZ) = $165
1 stick of the ram was bad, so have to RMA 
I could at least POST at 500x7 without trouble, once I get an OS I'll see how stable that really is and maybe go beyond if I can. |
Weeks later this hardware is nothing but trouble >_>
I got my ram back from RMA and I think they sent me the same set back, because I still have 1 bad stick giving me memory errors. Thats 1 demerit on OCZ since they said they sent me a brand new set
/offtopic
This C2D is cooled by a e6600 stock HSF (copper core). It idles low, 25-29c depending on room temp, but the second I start prime my temps rocket. 1s after starting my temps have already risen 10c. After 3s I'm in the 50s, and after about 1min I'm near 60c. This is crazy considering its a C2D and its not overclocked atm (2.33ghz), anybody else have this experience? Most Intel mobos come with a plastic standoff that you put on the backside of the mobo behind the processor, this I thought was mainly to prevent shorts. I'm wondering now though if they're really meant to keep the motherboard from bending as much as they do with Intel HSF attached (I have some serious bendage going on with my mobo). I'm also wondering if that bending of the motherboard is causing poor contact for my hsf and processor
When I took the HSF off a week ago to test a different processor, I found that only a small sliver of the processor's arctic silver was actually disturbed/used. The vast majority of the grease still had the same spread that I originally gave it. Does anybody know if putting that standoff on the backside of the motherboard helps correct the bending of the motherboard, and in turn creates better contact with stock HSFs?
