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Unread 03-15-2002, 10:51 PM   #17
phosphor
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Join Date: Dec 2000
Location: DC
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I was waiting for someone to show this type of design. I know that IBM’s high-speed machines had a similar design, but I wonder if they ever patented it? (more than probably) I wanted to know if a hybrid type of design would fly. The milling of copper can be time consuming, especially with a difficult design. OTOH, if one could use a copper heatsink (i.e. Alpha or something like this), the milling of the pins could be avoided. I know that many of the heatsink manufacturers are going with fins similar to those on the radiatiors in some cases. Why not use their copper heatsink for the surface area and embed it into a copper box (block). One can get very creative with the fins on the copper heatsink to direct the flow of the water to reach all areas of the copper block with very little dead area. I know that the poly-blocks are the premiere things into this arena, however these things are limited to a small following and the water flows can be questionable.

Many designs have dwelled into the flow problems, but surface area can also make up for the heat transfer problems. Perhaps, I am looking at this from the wrong vantagepoint.
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