"an array of thermal sensors across the plate" - you're after the heat flux rate ?
it seems more direct to accurately measure voltage and current (simultaneously), that's the applied power
- assuming no (or very low) losses, that's then also the inputted power
"knowing the total heat output, knowing the contact patch size, and knowing that the setup is 100% insulated, you can get the actual heat density and load thats being sent to the HSF. From there you can get what the face temp is"
sure about that calc ?
R(subscript)thetaJA will yield a junction temp, but you're talking about calculating the substrate temp, one thermal interface removed from the sensors
I do a bunch of this kind of testing, but I sure would not attempt the calcs (with any degree of confidence)
good luck
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